Brief Course Outline

Part 1: SMT Overview

• SMT Process Steps 
• SMT Passive and Active Components
• BGA, BTC, Flip chip and MCM
• Implementation Strategy & Summary
• Review/Questions/Answers

Part 2: Designing For Manufacturing

DFM for Lead Free Only

• Laminate & Surface Finishes
• Component Considerations
• Reliability Considerations

DFM for both Tin-Lead and Lead Free

• Handling of Moisture Sensitive Components
• Land Pattern Design
• Via Size, Spacing & Layer Count Considerations
• Testability
• Review/Questions/Answers

Part 3: Manufacturing Processes

• Adhesive and Its application
• Solder paste and its application
• Solderability & Soldering (Wave & Reflow)
• Application Specific Soldering
  • Selective Soldering
  • Vapor Phase Soldering
  • Laser Soldering
  • Low Temperature Soldering
  • Mixed Alloy Soldering

• Flux and Cleaning and No Clean
• Quality Control, Inspection and Repair
• Review/Questions/Answers

Part 4: Brining it All Together: RootCause Analysis of Defects

• Examples of Defects related to Design
• Examples of Defects related to incoming materials’
• Examples of Defects related to Manufacturing processes
• Key Strategies in preventing in design and manufacturing processes to prevent fieldreturns

Part 5:  Discussion of defects you are experiencing.

• Discussion of Defects of interest to you
• Detailed (18 Page) Quiz to review the material covered